| Keynotes | |
| 2025 | |
| 1. | “Monitoring Joule Heating in High Power Electronics”, XII International Congress on Mechanical Engineering, Mechatronics and Automation (CIMM 2025), Monteria, Colombia, May 15, 2025 |
| Workshops | |
| 2026 | |
| 4. | “Transient Thermal Dynamics in RF Wide Bandgap Semiconductors”, Workshop, IEEE 2026 International Microwave Symposium, Boston, MA, June 8, 2026 |
| 3. | “Probing the Channel Temperature in Poor Thermally Conductive Ultra-Wide Bandgap Semiconductor Devices”, Materials Research Society (MRS), Wide and Ultrawide Bandgap Materials, Devices and Applications Virtual Workshop, March 24, 2026 |
| 2. | “Improving Electro-Thermal Co-Design of Semiconductors Through Advanced Thermoreflectance Imaging”, Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), March 10, 2026 |
| 2025 | |
| 1. | “Thermal Dynamics in Low Thermally Conductive Ultra-Wide Bandgap Semiconductors”, Workshop, IEEE 2025 International Microwave Symposium, San Francisco, CA, June 16, 2025 |
| Invited Talks | |
| 2026 | |
| 12. | “Multiscale Device to Package Level Thermal Management of RF and Power Electronics”, Midwest Microelectronics Consortium, May 19, 2026 |
| 11. | “Absolute and Relative Temperature Measurements by Transient Gate Resistance Thermometry and Transient Thermoreflectance Imaging”, Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), March 11, 2026 |
| 2025 | |
| 10. | “Package to Device Thermal Considerations of Wide Bandgap Semiconductors”, Second Northeast Power Electronics Symposium (NEPES 2025), November 14, 2025 |
| 9. | “Probing the Channel Temperature in Poor Thermally Conductive Ultra-Wide Bandgap Semiconductor Devices”, 2025 Spring Materials Research Symposium (MRS), Seattle, WA, April 7, 2025 |
| 8. | “Thermal Metrology for Emerging Semiconductor Devices”, MIT Thermal Transport Cafè, March 7, 2025 |
| 2024 | |
| 7. | “Hyperspectral Thermal Imaging of Wide Bandgap Semiconductor Devices”, Electrical and Computer Engineering, University of Connecticut, February 7, 2024 |
| 2023 | |
| 6. | “Thermal Evaluation of Emerging Ultra-Wide Bandgap Semiconductors for Power Electronics”, International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2023, October 25, 2023, San Diego, CA |
| 5. | “Revealing nanoscale transport mechanisms with scanning probe methods”, Quantum Sensing and Nano Electronics and Photonics XIX, San Francisco, CA, January 30, 2023. |
| 2022 | |
| 4. | “Enhancing Thermal Transport Across Interfaces: Transitioning from the Microscale to Nanoscale”, Material Science and Engineering, University of Maryland, Sept 28, 2022 |
| 3. | “Micro to nanoscale thermal characterization of wide bandgap electronics”, 2022 Power Electronics and Energy Conversion Workshop, Albuquerque, NM, August 24, 2022 |
| 2021 | |
| 2. | “Enhancing thermal transport across interfaces: Transitioning from the microscale to nanoscale”, Nanoscale Device Characterization Division, National Institute of Standards and Technology, November 18, 2021 |
| 2020 | |
| 1. | “Thermal Characterization of Semiconductors and Memristors: Transitioning from the microscale to nanoscale”, Invited Talk, Naval Research Laboratory (2020) |