| Book Chapters |
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| 2022 |
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| 1. |
G. Pavlidis, B. Foley, S. Graham, “Thermal Management of Gallium Nitride Electronics: Gate Resistance Thermometry: An Electrical Thermal Characterization Technique”, Book Chapter, Elsevier, March 2022 |
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| Journal Publications |
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| 2023 |
|
| 20. |
A. Centrone, B. Lerma‐Berlanga, A. J. Biacchi, C. Fernández‐Conde, G. Pavlidis, C. Marti‐Gastaldo, “Direct Visualization of Chemically Resolved Multilayered Domains in Mixed‐Linker Metal–Organic Frameworks”, Advanced Functional Materials, June 2023 |
| 19. |
M. P. West, G. Pavlidis, R. H. Montgomery, F. F. Athena, M. S. Jamil, A. Centrone, S. Graham, E. M. Vogel, “Thermal environment impact on HfOx RRAM operation: A nanoscale thermometry and modeling study”, Journal of Applied Physics, Vol. 133, Issue 18, May 2023 |
| 18. |
M. Wang, G. Ramer, D. J. Perez-Morelo, G. Pavlidis, J. J. Schwartz, L. Yu, R. Ilic, A. Centrone,V. A. Aksyuk, “Beating thermal noise in a dynamic signal measurement by a nanofabricated cavity optomechanical sensor”, Science Advances, Vol 9, Issue 11, Mar 2023
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| 2022 |
|
| 17. |
J.J. Schwartz, G. Pavlidis, A. Centrone “Understanding Cantilever Transduction Efficiency and Spatial Resolution in Nanoscale Infrared Microscopy”, Analytical Chemistry, Vol. 94, Issue 38, pp. 13126-13135, September 2022 |
| 16. |
M. Wang, G. Ramer, D. J. Perez-Morelo, G. Pavlidis, J. J. Schwartz, L. Yu, R. Ilic, V. A. Aksyuk, A. Centrone, “High Throughput Nanoimaging of Thermal Conductivity and Interfacial Thermal Conductance”, ACS Nano Letters, May 2022 |
| 15. |
X. Ma, G. Pavlidis, E. Dillon, V. Beltran, J.J. Schwartz, M. Thoury, F. Borondics, C. Sandt, K. Kjoller, B. Berrie, A. Centrone, “Micro to nano: multiscale IR analyses reveal zinc soap heterogeneity in a 19th-century painting by Corot”, Analytical Chemistry, February 2022 |
| 2021 |
|
| 14. |
G. Pavlidis, J.J. Schwartz, J. Matson, T. Folland, S. Liu, J.H. Edgar, J.D. Caldwell, A. Centrone, “Experimental confirmation of long hyperbolic polariton lifetimes in monoisotopic (10B) hexagonal boron nitride at room temperature”, APL Materials, Vol. 9, Issue 9, pp. 091109, 2021
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| 13. |
X. Ma, G. Pavlidis, E. Dillon, K. Kjoller, B. Berrie, A. Centrone, “Nanoscale IR spectroscopy: From Principles to Nanoscale Imaging and Identification of Metal Soaps”, Microscopy and Microanalysis, Vol. 27, Issue S1, pp. 2814-2815, August 2021 |
| 2020 |
|
| 12. |
G. Pavlidis, A.M. Hilton, J.L. Brown, E.R. Heller, S. Graham, “Monitoring the Joule Heating Profile of GaN/SiC HEMTs via Cross Sectional Thermal Imaging”, Journal of Applied Physics, Editor’s Pick, Vol. 12, Issue 7, pp. 75705, 2020
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| 11. |
G. Pavlidis, L. Yates, D. Kendig, C.F. Lo, H. Marchand, B. Barabadi, S. Graham, “The effect of Superlattices on the thermal performance of GaN/Si HEMTs using near-bandgap thermoreflectance imaging”, IEEE Transactions on Electron Devices, Vol. 67, Issue 3, pp. 822-827, 2020
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| 2019 |
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| 10. |
X. Ma, V. Beltran, G. Ramer, G. Pavlidis, D. Parkinson, M. Thoury, T. Meldrum, A. Centrone, B. Berrie, “Revealing the Distribution of Metal Carboxylates in Oil Paint from the Micro‐ to Nanoscale”, Angewandte Chemie, Vol. 58, Issue 34, pp. 11652-11656, 2019
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| 9. |
Pavlidis, S.H. Kim, I. Abid, M. Zegaoui, F. Medjdoub, S. Graham, “The Effects of AlN and Copper Back Side Deposition on the Performance of Etched Back GaN/Si HEMTs”, IEEE Electron Device Letters, Vol. 40, Issue 7, pp. 1060-1063, 2019
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| 8. |
J. Goodwill, G. Ramer, D. Li, B. Hoskins, G. Pavlidis, J.J. McClelland, A. Centrone, J. Bain, M. Skowronski, “Spontaneous current constriction in threshold switching devices”, Nature Communications, Vol. 10, Issue 1, pp. 1628, 2019 |
| 7. |
A. Cutivet, G. Palvidis, B. Hassan, M. Bouchilaoun, C. Rodriguez, A. Soltani, S. Graham, F. Boone, H. Maher, “Scalable Modeling of Transient Self-Heating of GaN High-Electron-Mobility Transistors Based on Experimental Measurements”, IEEE Transaction on Electron Devices, Vol. 66, Issue 5, pp. 2139-215, 2019
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| 6. |
G. Pavlidis, S. Som, J. Barrett, W. Struble, S. Graham, “The impact of temperature on GaN/Si HEMTs under RF operation using gate resistance thermometry”, IEEE Transactions on Electron Devices, Vol. 66, Issue 1, pp. 330-336, 2019
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| 2018 |
|
| 5. |
G. Pavlidis, E. R. Heller, D. Kendig, S. Graham, “Transient Thermal Characterization of AlGaN/GaN HEMTs Under Pulsed Biasing”, IEEE Transactions on Electron Devices, Vol. 65, Issue 5, pp. 1753-1758, 2018 |
| 4. |
E. Tamdogan, G. Pavlidis, S. Graham, M. Arik, “A Comparative Study on the Junction Temperature Measurements of LEDs With Raman Spectroscopy, Microinfrared (IR) Imaging, and Forward Voltage Methods” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 8, Issue 11, pp. 1914-1922, 2018 |
| 3. |
J. Dallas, G. Pavlidis, B. Chatterjee, J.S. Lundh, M. Ji, J. Kim, T. Kao, T. Detchprohm, R.D. Dupuis, S. Shen, S. Graham, S. Choi “Thermal Characterization of Gallium Nitride p-i-n Diodes”, Applied Physics Letters, Vol. 112, Issue 7, 2018
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| 2017 |
|
| 2. |
G. Pavlidis, S. Pavlidis, E. R. Heller, E. A. Moore, R. Vetury, and S. Graham, “Characterization of AlGaN/GaN HEMTs Using Gate Resistance Thermometry,” IEEE Transactions on Electron Devices, vol. 64, pp. 78-83, 2017. |
| 2015 |
|
| 1. |
P. M. Campbell, A. Tarasov, C. Joiner, M.Y. Tsai, G. Pavlidis, S. Graham, W. J. Ready, E. Vogel, “Field-effect transistors based on wafer-scale, highly uniform few-layer p-type WSe2”, Nanoscale, vol. 8, pp. 2268-2276, 2015 |
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| Conference Publications |
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| 2023 |
|
| 15. |
B. Bista, P. Golani, F. Liu, T. Truttmann, G. Pavlidis, A. Centrone, B. Jalan, S. Koester, “Evaluating the thermal performance of perovskite SrSnO3 field effect transistors”, IEEE Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, June 1st, Orlando, FL |
| 14. |
G. Pavlidis, M. Jamil, B. Bista, “Sub-Bandgap Thermoreflectance Imaging of Ultra-Wide Bandgap Semiconductors”, 243rd ECS Meeting, Wide-Bandgap Semiconductor Materials and Devices 24, 2023, May 30th, Boston, MA |
| 13. |
G. Pavlidis, “Revealing nanoscale transport mechanisms with scanning probe methods”, Proc. SPIE PC12430, Quantum Sensing and Nano Electronics and Photonics XIX, PC124300J, 2023, January 31st, San Francisco, CA |
| 2022 |
|
| 12. |
M. Wang, D. J Perez-Morelo, G. Ramer, G. Pavlidis, J.J. Schwartz, A. Centrone, V. Aksyuk, “Nanophotonic Scanning Probes for Nanoscale Imaging of Thermal Conductivity and Interfacial Thermal Conductance”, Conference on Lasers and Electro-Optics (CLEO), 2022, May 15th, San Jose, CA, USA |
| 2018 |
|
| 11. |
D. Kendig, G. Pavlidis, S. Graham, S. Reiter, M. Gurr, D. Altman, S. Huerster, A. Shakouri, “UV Thermal Imaging of RF GaN Devices with GaN Resistor Validation”, 91st ARFTG Microwave Measurement Conference, 2018, June 15th, Philadelphia, PA |
| 10. |
G. Pavlidis, D. Kendig, L. Yates, S. Graham, “Improving the Transient Thermal Characterization of GaN HEMTs”, IEEE Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018, May 29th, San Diego, CA |
| 9. |
L. Yates, G. Pavlidis, S. Graham, S. Usami, K. Nagamtsu, Y. Honda, H. Amano, “Electrical and thermal analysis of vertical GaN-on-GaN PN diodes”, IEEE Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2018, May 29th, San Diego, CA |
| 8. |
G. Pavlidis, S. Som, J. Barrett, W. Struble, J. Atherton, S. Graham, “Gate Resistance Thermometry for GaN/Si HEMTs under RF Operation”, International Conference on Compound Semiconductor Manufacturing Technology (CS Mantech) 2018, Austin, TX |
| 2017 |
|
| 7. |
G. Pavlidis, J. Dallas, S. Choi, S.C. Shen, S. Graham, “Steady State and Transient Thermal Characterization of Vertical GaN PIN Diodes”, Technical Paper, International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) 2017, August 29 – September 1, 2017, San Francisco, CA |
| 6. |
J. Dallas, G. Pavlidis, B. Chatterjee, J.S. Lundh, M. Ji, J. Kim, T. Kao, T. Detchprohm, R.D. Dupuis, S. Shen, S. Graham, S. Choi “Thermal Characterization of GaN vertical pin Diodes”, Technical Paper, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ITHERM 2017, May 30 – June 2, 2017, Orlando, FL |
| 5. |
G. Pavlidis, S. Graham, “Monitoring the Transient Thermal Response of AlGaN/GaN HEMTs using Transient Thermoreflectance Imaging”, Technical Paper, Session 11.1, International Conference on Compound Semiconductor Manufacturing Technology (CS Mantech) 2017, May 22-25, Indian Wells, CA |
| 2016 |
|
| 4. |
T. R. Harris, G. Pavlidis, E. Wyers, D. Newberry, S. Graham, P. Franzon, R. Davis, “Thermal Raman and IR measurement of heterogeneous integration stacks”, Technical Paper, Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ITHERM 2016, May 31 – June 3, 2016, Las Vegas, NV |
| 3. |
G. Pavlidis, D. Mele, T. Cheng, F. Medjdoub, S. Graham, “The Thermal Effects of Substrate Removal on GaN HEMTs using Raman Thermometry”, Technical Paper, Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ITHERM 2016, May 31 – June 3, 2016, Las Vegas, NV |
| 2015 |
|
| 2. |
T. R. Harris, E. Wyers, L. Wang, G. Pavlidis, S. Graham, P. Franzon, R. Davis, “Thermal Simulation of Heterogeneous GaN/InP/Silicon 3DIC Stacks”, Paper, Technical Session X:3D Thermal Issues, IEEE International 3D Systems Integration Conference (3DIC), August 31 –September 2, 2015, Sendai, Japan |
| 2014 |
|
| 1. |
K. Maize, G. Pavlidis, E. Heller, L. Yates, D. Kendig, S. Graham, A. Shakouri, “High Resolution Thermal Characterization and Simulation of Power AlGaN/GaN HEMTs Using Micro-Raman Thermography and 800 Picosecond Transient Thermoreflectance Imaging”, Compound Semiconductor Integrated Circuit Symposium, IEEE , pp.1-8, October 19-22 , 2014, La Jolla, CA |